घर > उत्पादों > सोने से मढ़वाया हुआ चांदी का तार >
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

उत्पत्ति के प्लेस:

चीन

ब्रांड नाम:

WINNER

प्रमाणन:

ISO9100

हमसे संपर्क करें
बोली मांगें
उत्पाद का विवरण
कलई करना:
सोना
बांड शक्ति:
उच्च
प्रमाणन:
आईएसओ 9001
संक्षारण प्रतिरोध:
उच्च
बढ़ाव:
3-20%
उत्पाद का प्रकार:
बॉन्डिंग वायर
सतह खत्म:
चिकना, मैट, बनावट वाला
व्यास:
0.7-1.0मिलि
सामग्री:
सोना चांदी
पवित्रता:
99.99%
प्रमुखता देना:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

भुगतान और शिपिंग की शर्तें
न्यूनतम आदेश मात्रा
1000 मीटर
मूल्य
999
पैकेजिंग विवरण
रोल, न्यूट्रियल पैकिंग या ओईएम लोगो के साथ
प्रसव के समय
5-8 दिन
भुगतान शर्तें
टी/टी, डी/ए, वेस्टर्न यूनियन
आपूर्ति की क्षमता
9999999
संबंधित उत्पाद
अच्छी कीमत Ultra Thin 0.05mm Gold Coated Silver Spooled Wire For High Reliability Electrical Interconnects ऑनलाइन वीडियो

Ultra Thin 0.05mm Gold Coated Silver Spooled Wire For High Reliability Electrical Interconnects

सबसे अच्छी कीमत पाएं
अच्छी कीमत 0.05mm Diameter Gold Plated Silver Wire for Scientific Research and Laboratory Use ऑनलाइन वीडियो

0.05mm Diameter Gold Plated Silver Wire for Scientific Research and Laboratory Use

सबसे अच्छी कीमत पाएं
हमसे संपर्क करें
अब संपर्क करें
उत्पाद का वर्णन
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5

अपनी पूछताछ सीधे हमें भेजें

गोपनीयता नीति चीन अच्छी गुणवत्ता बंधन तार आपूर्तिकर्ता. कॉपीराइट © 2024-2025 SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. सभी अधिकार सुरक्षित हैं।